Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
, S28-02, 2011. 11. IPC, Design and Assembly Process Implementation for BGAs, IPC-7095 Standard, August, 2000. 12. J. Lau and Y.Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, ISBN 0-07-036648-9, McGraw Hill, 1997. pp
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
, S28-02, 2011. 11. IPC, Design and Assembly Process Implementation for BGAs, IPC-7095 Standard, August, 2000. 12. J. Lau and Y.Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, ISBN 0-07-036648-9, McGraw Hill, 1997. pp
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