Lewis & Clark | https://www.lewis-clark.com/shop/page/12/
: USA / FOB Origin Availability: Immediate for purchase / 2-4 weeks for shipping Out Of Stock MVP 1820 Ultra II AOI (2007) Make: MVP Model: 1820 Ultra II Vintage
Lewis & Clark | https://www.lewis-clark.com/shop/page/3/
” Vertical Alignment Upward Vision Camera for Fine Pitch Components and BGA Ball Inspection Max Feeder Capacity: (120) 8mm Feeders (Feeders available separately
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
, S28-02, 2011. 11. IPC, Design and Assembly Process Implementation for BGAs, IPC-7095 Standard, August, 2000. 12. J. Lau and Y.Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, ISBN 0-07-036648-9, McGraw Hill, 1997. pp
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
, S28-02, 2011. 11. IPC, Design and Assembly Process Implementation for BGAs, IPC-7095 Standard, August, 2000. 12. J. Lau and Y.Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, ISBN 0-07-036648-9, McGraw Hill, 1997. pp
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_screen_printers_mpmultraprint100.html
. The Ultraprint 100 is suitably matched for companies that do not need the high volume output and ultra-fine pitch of an automatic printer
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/vision-systems
. Based on medical endoscope technology, it is perfect for ultra fine pitch devices such as fine wire bonds or very small geometries such as micro bumps and copper pillars
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_aoi_mvp.html
for a variety of component types including: QFP's, SOICs, SOTs, MELFs, Diodes, chips resistors and capacitors, including 10 mil fine pitch and 0402s
| https://www.eptac.com/class/advanced-micro-smt-hand-soldering/
of small, surface mount components in either placement or rework of, this is the course for you. This two (2) day Advanced Surface Mount Micro Hand Soldering program focuses on the proper techniques for placement, soldering, and rework of fine pitch surface mount components such as chip components ranging in
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/wire-pull
). Nordson DAGE bondtesters fully conform to or exceed these standards. The standards contain specifications for acceptance or rejection criteria. Small geometry (Ultra Fine Pitch
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