ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/solder-paste/fluxplus-paste-flux
work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
. Don't forget to also check out the upcoming webinars and webtorials which you can attend live this year! Members: log on now to receive your discounted member pricing. Not a member
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/advice-for-solder-mask-paste-mask-layers_topic484_page1.html
% area reduction in the thermal pad of a QFN package. 3. Maybe it is not directly your advice but somewhere I red about putting solder mask on these thermal via to avoid solder paste wicking. 4. The solderdam
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/advice-for-solder-mask-paste-mask-layers_topic484.html
% area reduction in the thermal pad of a QFN package. 3. Maybe it is not directly your advice but somewhere I red about putting solder mask on these thermal via to avoid solder paste wicking. 4. The solderdam
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic484&OB=ASC.html
% area reduction in the thermal pad of a QFN package. 3. Maybe it is not directly your advice but somewhere I red about putting solder mask on these thermal via to avoid solder paste wicking. 4. The solderdam
Lewis & Clark | http://www.lewis-clark.com/product-tag/solder-paste-inspection/
! Additional details available on request. Condition: Complete & Operational Location: USA / FOB Origin Availability: Immediate Pemtron TROI-7700 HL SII 3D Solder Paste Inspection System- 2017 Make: Pemtron Model
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
+ cycles Investigation Conclusion: Overall void density on BGA component was not high Solder crack path typically found at solder joint / BGA package interface 165 Planar (flat
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
+ cycles Investigation Conclusion: Overall void density on BGA component was not high Solder crack path typically found at solder joint / BGA package interface 165 Planar (flat
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Solder Joint Void Classifications [3] Figure 2a. Locations within a BGA solder joint where voids are expected to have a greater risk on joint reliability [3]. mailto:richard.coyle@nokia-bell-labs.com mailto:david.hillman
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. Solder Joint Void Classifications [3] Figure 2a. Locations within a BGA solder joint where voids are expected to have a greater risk on joint reliability [3]. mailto:richard.coyle@nokia-bell-labs.com mailto:david.hillman
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
