Imagineering, Inc. | https://www.pcbnet.com/blog/what-are-lamination-voids-in-pcb-manufacturing/
Close Search What Are Lamination Voids in PCB Manufacturing? By Behind the Work June 16, 2022 September 21st, 2023 Blog , Industry News No Comments Lamination voids, also known as delamination, are a problem that can occur in the printed circuit board manufacturing process
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2596-delaminations-in-substrate
BGA - MC to Substrate Delamination - Application Note 2596 Sample & Method In the image the echoes from the ultrasonic C-SAM transducer were gated on the interface between the molding compound and the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/automotive-and-transportation?con=t&page=9
-Aug52014 Nordson SONOSCAN 3D AMI Nordson SONOSCAN Smart Card 3D Acoustic Microscope Image - Application Note 452 DIE ATTACH DELAMINATIONS Nordson SONOSCAN CSP Die Attach Delamination, Through Transmission
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=10
: Electronics - Assembly and Packaging DIE SURFACE DELAMINATIONS Nordson SONOSCAN TQFP Die Surface Delaminations - Application Note 2566 CSP DELAMINATIONS Nordson SONOSCAN CSP Delamination
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/lighting-and-led?con=t&page=9
1020 3D AMI Nordson SONOSCAN Smart Card 3D Acoustic Microscope Image - Application Note 452 DIE ATTACH DELAMINATIONS Nordson SONOSCAN CSP Die Attach Delamination, Through Transmission - Application Note
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Nordson SONOSCAN CSP Die Attach Delamination, Through Transmission - Application Note 657 PQFP PRODUCTION SCANNING Nordson SONOSCAN PQFPs Production Scanning - Application Note 434 Waterfall™
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/applications/test-and-inspection?con=t&page=9
Attach Delamination, Through Transmission - Application Note 657 PQFP PRODUCTION SCANNING Nordson SONOSCAN PQFPs Production Scanning - Application Note 434 US8794072-Aug52014 Nordson SONOSCAN DIE
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1204-delaminations
Delamination - Application Note 1204 Sample & Method One polymer coated aluminum sample. Interface Scan imaging technique utilized. Result White areas indicate locations of delamination present at the polymer coating to aluminum bond interface
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0148-pqfp-die-attach
. The red area is an extensive delamination where the die attach material is not bonded to the die above. Delaminations, whether large or small, are sites where moisture is likely to collect
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2641-3d-delaminations
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