7095 delamination under component results

Library Expert 2018.06 Released!! - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2360&OB=ASC.html

!! NEW / ENHANCED: Proteus: Added the ability to output to PADS Layout Part Type .p and Decal .d files FIXED: Calculator: Fixed an issue in the PQFN component family for parts under

PCB Libraries, Inc.

Library Expert 2018.06 Released!! - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2360&OB=DESC.html

!! NEW / ENHANCED: Proteus: Added the ability to output to PADS Layout Part Type .p and Decal .d files FIXED: Calculator: Fixed an issue in the PQFN component family for parts under

PCB Libraries, Inc.

Library Expert 2018.06 Released!! - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2360&OB=ASC.html

!! NEW / ENHANCED: Proteus: Added the ability to output to PADS Layout Part Type .p and Decal .d files FIXED: Calculator: Fixed an issue in the PQFN component family for parts under

PCB Libraries, Inc.

IPC Standard for Footprint Naming Convention - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc-standard-for-footprint-naming-convention_topic1751.html

.  But what about component naming (one PCB footprint can be used in many components). I know it is out of  Library Expert (only footprints under  Library Expert

PCB Libraries, Inc.

IPC Standard for Footprint Naming Convention - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1751&OB=DESC.html

.  But what about component naming (one PCB footprint can be used in many components). I know it is out of  Library Expert (only footprints under  Library Expert

PCB Libraries, Inc.

SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/

: Regarding gold removal requirement under Section 4.5.1 of J-STD-001, it allows: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly

SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering

: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”...   Question: Regarding gold removal requirement under Section

PCB Libraries Forum : SON / QFN Calculations

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_son-qfn-calculations_topic889.xml

; We have found that when the center pad is completely surrounded by solder mask voiding in the solder joint increases and the ability to clean flux residues out from under these parts is difficult if not impossible. 

PCB Libraries, Inc.

) Placement Accuracy Chip ±28μm @ Cpk≥ 1.0 IC ±35μm @ Cpk≥ 1.0 Component Range Fly Camera 03015 ~ □16mm Fix Camera ~ □42mm (Standard) □42mm ~ □55mm (MFOV) L55mm ~ L75mm Connector (MFOV) Max. Height 10mm (Fly), 15mm (Fix) PCB Size (mm) Min. 50(L) x 40(W) Max

| http://www.szhonreal.com/uploadfile/Download/202304271726211784.pdf

Guillotine type V-cut PCB Cutting Machine_Shenzhen Honreal Technology CO.,Ltd.

| http://www.szhonreal.com/productview.asp?id=60

. For internal strength generates during separation, Minimize it to value under 180uE , to avoid solder crack or component damage 2