Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
., Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephani Gulbrandsen, Julie Silk, Alex Chiu, and Yew-Hoong Chan Abstract 26-4 Is a High Phosphorus Content in the Nickel Layer A Root Cause for Black Pad on ENIG Finishes? Dipl.-Ing. Mustafa Özkök, Joe
Heller Industries Inc. | https://hellerindustries.com/recent-searches/
soldering Reflow soldered joint Reflow reballing Reflow profile for sac305 Reflow pcb oven Reflow oven soldering Reflow oven profile Reflow oven pcb Reflow medical Reflow led Reflow joints Reflow gpu
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
] Investigation Specifics: 84 I/O Plastic CSP, daisy chained, 0.3mm (12 mil) diameter solderballs Sn63 solder paste Test vehicle: Characteristics not available, Immersion Silver (IAg) and ENIG finishes Thermal cycling: 0°C-100
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
] Investigation Specifics: 84 I/O Plastic CSP, daisy chained, 0.3mm (12 mil) diameter solderballs Sn63 solder paste Test vehicle: Characteristics not available, Immersion Silver (IAg) and ENIG finishes Thermal cycling: 0°C-100
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
+125oC for 5800 cycles. It was observed that ENIG surface finish improves the component reliability comparing to OSP and ImAg. It is also observed that matching solder sphere with solder paste alloys improves the reliability in several cases, but a significant improvement was not observed when compared with the SAC305 solder spheres
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
+125oC for 5800 cycles. It was observed that ENIG surface finish improves the component reliability comparing to OSP and ImAg. It is also observed that matching solder sphere with solder paste alloys improves the reliability in several cases, but a significant improvement was not observed when compared with the SAC305 solder spheres
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