| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml
. According to the IPC standard, non-wetting is defined as the inability of molten solder to form a metallic bond with the base metal. This results in the PCB pads or the
| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_17_07.pdf
| https://www.eptac.com/are-voids-in-solder-joints-really-an-issue/
. This is data, not anecdotal evidence, so we should pay attention. Voids are truly a phenomenon in liquid physics, where you have two liquids, molten solder and some other non-metallic liquid, such as flux and carrying vehicles
| https://www.eptac.com/blog/are-voids-in-solder-joints-really-an-issue
. This is data, not anecdotal evidence, so we should pay attention. Voids are truly a phenomenon in liquid physics, where you have two liquids, molten solder and some other non-metallic liquid, such as flux and carrying vehicles
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. Alloys are called eutectic when the solidus and liquidus are equal. While wetting begins at the solidus temperature, best wetting is achieved at a peak temperature 15º
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-solderpaste-pininpaste.php
. The Pin-In-Paste process allows through-hole components not only to be soldered at the same time but it also allows use of the same process as surface mounted components
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