ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2566-die-surface-delaminations
DIE SURFACE DELAMINATIONS ACOUSTIC Products Corporate | Global Directory Division Only All of Nordson Home Products/Instruments View All Products LABORATORY ● Gen7 ● D9650 ● D9650Z PRODUCTION ● FastLine P300 ● Facts2 DF2400
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0245-pbga-popcorn-crack
PBGA POPCORN CRACK ACOUSTIC Products Corporate | Global Directory Division Only All of Nordson Home Products/Instruments View All Products LABORATORY ● Gen7 ● Gen6 ● D9600 ● D9600Z PRODUCTION ● FastLine P300 ● Facts2 DF2400
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0309-tsop-die-cracks
. Gating was at the interface between the die and the die attach layer. Result Both examples exhibit cracks in the die. The die crack in the package at lower left above is large and complex
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0306-smart-card-cracked-die
. Result The die in this Smart card has been cracked and the symmetry of the crack suggests that the cracking occurred as a result of improper handling during assembly
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/overhanging-die-shear
. Performing ball bond shear testing can be difficult due to the thin spacing between die and low profile wire bonding and the possible deflection of the surface during load tool landing and setting
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0759-tsop-cracked-die
). Each tray held 60 devices. Gating was on the die. Result There are no molding compound to die surface delaminations in the samples
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0147-pqfp-die-cracks
& Method A PQFP was imaged from the top side at a frequency of 50 MHz. Gating was at the die surface to mold compound interface. Result The longer red areas are cracks in the die
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/die-shear
. Conformal coating tools Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883 Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/micro-testing-thin-die
. Micro Testing Thin Die Inorganic semiconductors are brittle and their strength is greatly affected by the presence of surface flaws created by dicing and handling
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/overhanging-die
. Performing ball bond shear testing can be difficult due to the thin spacing between die and low profile wire bonding and the possible deflection of the surface during load tool landing and setting
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Training Provider / Events Organizer / Association / Non-Profit
6600 City W Pkwy
Eden Prairie, MN USA
Phone: 952-920-7682
