ORION Industries | http://orionindustries.com/pdfs/mylarel1-5.pdf
. Typical Values for Major Properties Tensile Dimensional Nominal Strength Stability Dielectric Thickness, MD/TD,* Elongation MD/TD,* Strength (AC), µm (Gauge) kg/mm2 (kpsi) MD/TD,* % % Shrinkage Haze, % kV (Min.) 12 (48) 18/22 (26/32) 110/70 2.0/1.0 4 2.8 19
| https://www.eptac.com/etrainings/ipc-a-600-instructor-certification-online/
Material Surface and Subsurface Solder Coatings and Fused Tin Lead Holes–Plated Through and Unsupported Printed Contacts Marking Solder Resist Dimensional Characteristics DAY 2 Internally Observable Characteristics Dielectric Materials Conductive Patterns Plated Through–Holes
| https://www.eptac.com/etrainings/ipc-a-600-standard-expert-certification-online/
Coatings and Fused Tin Lead Holes–Plated Through and Unsupported Printed Contacts Marking Solder Resist Dimensional Characteristics DAY 2 Internally Observable Characteristics Dielectric Materials Conductive Patterns Plated Through–Holes
| https://www.eptac.com/etrainings/ipc-a-600-specialist-certification-online/
Coatings and Fused Tin Lead Holes–Plated Through and Unsupported Printed Contacts Marking Solder Resist Dimensional Characteristics DAY 2 Internally Observable Characteristics Dielectric Materials Conductive Patterns Plated Through–Holes
Imagineering, Inc. | https://www.pcbnet.com/blog/material-choices-for-high-speed-flexible-circuits/
. Using flexible clads that will allow for minimal movement of the circuit will help to reduce stress as well. Other materials that may be used in conjunction with flexible clads are dielectric films and coverlays or bond plies
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/2019_ICEET_Program.pdf
., Ops A La Carte Co-Chair: Jason Rogers, M.G. Chemicals Influence of PCB Dielectric Material on the Resistance to Trace Cracking During Drop Impact Bev Christian, Ph.D
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/xaloy-wear-technology
. Filled resins are chosen for their superior properties, which include increased tensile and compressive strength, chemical resistance, dielectric, and thermal dimensional stability
Imagineering, Inc. | https://www.pcbnet.com/blog/category/blog/page/3/
. As one of the most common dielectric materials, FR4 is frequently used in a wide variety… Read More Nov 08 When to Use X-Ray Inspection in PCBs By Behind the Work Blog , Industry News Printed circuit boards are a crucial component for many electronic devices and are favored across manufacturing industries
