| https://www.eptac.com/etrainings/ipc-designer-certification-online/
PARAMETERS Printed Board and Assembly Viewing Principles Introduction to Datum Dimensioning Grid Systems Tooling Holes and Fiducials Board and Assembly Panelization Panel/Pallet Separation Methods DAY 2
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_transistor-familiy-for-dfn-3-pin_topic881.xml
:01pmPCB Footprint Expert strictly follows JEDEC dimensioning practices (just like most component manufacturer's also use JEDEC dimensions
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/transistor-familiy-for-dfn-3-pin_topic881.html
? Posted: 11 Mar 2013 at 6:01pm PCB Footprint Expert strictly follows JEDEC dimensioning practices (just like most component manufacturer's also use JEDEC dimensions
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic881&OB=ASC.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5188 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 11 Mar 2013 at 6:01pm PCB Footprint Expert strictly follows JEDEC dimensioning practices
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_bga-footprint_topic2430.xml
; uploads/30/NXP_SOT1968-1.fpxI would like to understand the geometric dimensioning and tolerancing notation that NXP used in the datasheet
| https://www.eptac.com/wp-content/uploads/eptac/datasheets/EPTAC_DataSheet_IPCDesigner_CID-Plus.pdf
• Component Mounting Shock and Vibration Requirements • Evaluation of Component Attachment Methods DOCUMENTATION AND DIMENSIONING • Parts List Development - BOM (Bill of Materials
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_IPCDesigner_CID-Plus.pdf
• Component Mounting Shock and Vibration Requirements • Evaluation of Component Attachment Methods DOCUMENTATION AND DIMENSIONING • Parts List Development - BOM (Bill of Materials
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/smdmounting-type-connectors-support-request_topic2878.html
? Currently the only way to generate such land patterns is to use SOIC or SOFL component types. But this component types provide wrong package dimensioning for the SMT headers
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-footprint_topic2430_post10003.html
. uploads/30/NXP_SOT1968-1.fpx I would like to understand the geometric dimensioning and tolerancing notation that NXP used in the datasheet
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/smdmounting-type-connectors-support-request_topic2878_post11471.html
. But this component types provide wrong package dimensioning for the SMT headers. Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined
