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Oberflächen Allgemeine Anwendungen Halogenidfrei Bleifreie, glänzende Lötfüllung Weniger Rückstände Pintransfer oder Dipping (niedrige Viskosität) Kurze Reflow-Zykluszeit
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. Pin transfer or dipping An application technique where the solder is applied by dipping a component or pin into the solder paste
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
second. Typical reflow methods that achieve rapid reflow include laser, solder iron, hot bar, and induction. Pin transfer or dipping An application technique where the solder is applied by dipping a component or pin into the solder paste. A thin
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pure resin, thermosetting polyimide pure resin 2. Polyimide PI molding methods include: high temperature curing, compression molding, dipping, spraying, calendering, injection molding, extrusion, die-casting, coating Laminating, casting, lamination, foaming, transfer molding, compression molding
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Solderability The ability of metal to be wetted by solder during the reflow process. Solder Paste Homogenous mixture of powdered solder alloy and paste flux. Solder pastes are formulated for application to a product using printing, dispensing, dipping, and
