| http://etasmt.com:9060/te_news_industry/2021-09-01/24163.chtml
. Improvement measures: Use more bottom heating (reflow oven with upper and lower heating modes are used) or very low temperature rise rate (between preheating and melting point) to realize an equilibrium with soldering pad before pins are wetted by solder. Three
| http://etasmt.com/te_news_industry/2021-09-01/24163.chtml
. Improvement measures: Use more bottom heating (reflow oven with upper and lower heating modes are used) or very low temperature rise rate (between preheating and melting point) to realize an equilibrium with soldering pad before pins are wetted by solder. Three
| http://etasmt.com/cc?ID=te_news_bulletin,20361&url=_print
. Sort the welded boards by order number, name, etc. To prevent bad mixing. Precautions for reflow soldering operations 1. Do not touch the mesh belt during the operation, and do not let water or oily objects fall into the furnace to prevent burns. 2
| http://etasmt.com:9060/te_news_bulletin/2020-11-07/20361.chtml
. Sort the welded boards by order number, name, etc. To prevent bad mixing. Precautions for reflow soldering operations 1. Do not touch the mesh belt during the operation, and do not let water or oily objects fall into the furnace to prevent burns. 2
| http://etasmt.com/te_news_bulletin/2020-11-07/20361.chtml
. Sort the welded boards by order number, name, etc. To prevent bad mixing. Precautions for reflow soldering operations 1. Do not touch the mesh belt during the operation, and do not let water or oily objects fall into the furnace to prevent burns. 2
| http://etasmt.com:9060/te_news_bulletin/2020-05-04/15961.chtml
. If there is a BGA, the peak temperature should be set within 240 to 260 degrees and maintained for about 40 seconds. In addition, it should be noted that in the reflow area, the reflow soldering time should not be too long, so as not to cause damage to the furnace, or cause the PCB board to be scorched or the component malfunctions
| http://etasmt.com/te_news_bulletin/2020-05-04/15961.chtml
. If there is a BGA, the peak temperature should be set within 240 to 260 degrees and maintained for about 40 seconds. In addition, it should be noted that in the reflow area, the reflow soldering time should not be too long, so as not to cause damage to the furnace, or cause the PCB board to be scorched or the component malfunctions
| http://etasmt.com:9060/te_news_industry/2021-09-01/24567.chtml
. The bottom component of the large board may fall during the second reflow process, or the bottom solder joint is partially melted, causing solder joint reliability problems. 3
| http://etasmt.com/te_news_industry/2021-09-01/24567.chtml
. The bottom component of the large board may fall during the second reflow process, or the bottom solder joint is partially melted, causing solder joint reliability problems. 3
| http://etasmt.com/cc?ID=te_news_industry,24567&url=_print
. The bottom component of the large board may fall during the second reflow process, or the bottom solder joint is partially melted, causing solder joint reliability problems. 3
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