9 draining solder results

Process and design-related causes-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23570&url=_print

• Excessive pad size • Via in pad draining solder from interconnection Reflow-related causes: • Preheat too aggressive • Peak reflow (liquidus) temperature not being attained

Tombstoning -PCB Soldering Problems-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23571&url=_print

  • Improper pad trace   • Improper solder mask application   • Via in pad draining solder from connection   • Trace with solder mask over it running under component causing a fulcrum effect on the component

Process and design-related causes-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23570.chtml

• Excessive pad size • Via in pad draining solder from interconnection Reflow-related causes: • Preheat too aggressive • Peak reflow (liquidus) temperature not being attained

Tombstoning -PCB Soldering Problems-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23571.chtml

  • Improper pad trace   • Improper solder mask application   • Via in pad draining solder from connection   • Trace with solder mask over it running under component causing a fulcrum effect on the component

Tombstoning -PCB Soldering Problems-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2021-08-31/23571.chtml

  • Improper pad trace   • Improper solder mask application   • Via in pad draining solder from connection   • Trace with solder mask over it running under component causing a fulcrum effect on the component

Process and design-related causes-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2021-08-31/23570.chtml

• Excessive pad size • Via in pad draining solder from interconnection Reflow-related causes: • Preheat too aggressive • Peak reflow (liquidus) temperature not being attained

Tombstoning PCB Soldering Problems

Heller Industries Inc. | https://hellerindustries.com/tombstoning/

: Improper pad design Improper pad trace Improper solder mask application Via in pad draining solder from connection Trace with solder mask over it running under component causing a fulcrum effect on

Heller Industries Inc.

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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/support/aftermarket-solutions/eu---trueblue-service-plans

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