Partner Websites: dwell (Page 1 of 9)

How To Set Up Vacuum Assisted Reflow Profile

Heller Industries Inc. | https://hellerindustries.com/heller/vacuum-profile-reflow/

. Higher vacuum levels tend to produce lower void rates but are associated with longer vacuum cycle times. Longer dwell times can also help with reducing void rates

Heller Industries Inc.

00600-248

Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf

. No. 1 — A Standard Profile? Figure 1 on page 110 includes the “ideal” reflow profile. It is characterized by a 2° to 4°C/sec ramp to a dwell zone of 30 to 90 sec at approximately 150

Heller 公司

How Challenging Conventional Wisdom Can Optimize Solder Reflow

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf

? Figure 1 on page 110 includes the “ideal” reflow profile. It is characterized by a 2° to 4°C/sec ramp to a dwell zone of 30 to 90 sec at approximately 150

Heller Industries Inc.

How Challenging Conventional Wisdom Can Optimize Solder Reflow

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/00600-248-1.pdf

? Figure 1 on page 110 includes the “ideal” reflow profile. It is characterized by a 2° to 4°C/sec ramp to a dwell zone of 30 to 90 sec at approximately 150

Heller Industries Inc.

ISC2 Pre-Cure Oven | Nordson Industrial Coating Systems

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/products/can-manufacturing-induction-dryers-and-heaters/isc2-pre-cure-oven

° internal spray for improved coverage in the seam area Provides longer dwell time at cure temperature with existing oven to improve cure Instant start/stop control saves energy and prevents

ASYMTEK Products | Nordson Electronics Solutions

Jetting Dispense Pump

GPD Global | https://www.gpd-global.com/co_website/pdf/pump/NCM5000-Jetting-Pump.pdf

. Pump Operation Pressure - controls the force of fluid exiting the pump Pump Open Time - adjusts fluid volume of a single shot Reservoir Pressure - controls reservoir fill speed Pump Dispense Dwell

GPD Global

Rechecking Thermal Profiles | EPTAC

| https://www.eptac.com/soldertips/rechecking-thermal-profiles/

. To verify the board is getting the correct amount of heat to prepare and dry out the solder paste and reflow the solder paste for a long enough dwell time to solder all the components, the thermal

Jetting Dispense Pump

GPD Global | https://www.gpd-global.com/pdf/pump/NCM5000-Jetting-Pump.pdf

. Pump Operation Pressure - controls the force of fluid exiting the pump Pump Open Time - adjusts fluid volume of a single shot Reservoir Pressure - controls reservoir fill speed Pump Dispense Dwell

GPD Global

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