| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
. For beam lead devices: (d-1) Silicon broken. (d-2) Beam lifting on silicon. (d-3) Beam broken at bond. (d-4) Beam broken at edge of silicon. (d-5
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
. For beam lead devices: (d-1) Silicon broken. (d-2) Beam lifting on silicon. (d-3) Beam broken at bond. (d-4) Beam broken at edge of silicon. (d-5
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/products/applicators/eb-60-flex-edge-banding-slot-applicator
EB 60 Flex Edge Banding Applicators For PUR & EVA Adhesive Application | Nordson Adhesive Dispensing Systems Adhesive Dispensing Systems Corporate | Global Directory
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/industries/furniture/edge-banding?con=t&page=3
Nordson Edge Banding Systems High-quality PUR and EVA Adhesive Bonds on Boards & Panels | Nordson Adhesive Dispensing Systems Adhesive Dispensing Systems Corporate | Global Directory
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/products/applicators/wide-web-spray-lamination-applicator
. Controlled adhesive fiber deposition in a cross-web direction improves bond performance. Produce high-loft tissue and towels with softness of hand and no visible adhesive residue
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/products/applicators/duet-dual-dispense-applicator
nonwoven disposable hygiene product manufacturing, heavier at the ends for high bond strength and a lighter stabilizing bond in the center to retain retractive force
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/industries/furniture/laminating?con=t&page=2
fiber deposition in a cross-web direction to improve bond performance EF 60 V Edge Filling and Edge Sealing Slot Applicator Adhesive Dispensing Systems Achieve a smooth edge and high-quality finished look
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/additional-filter-product-subtype/tankless-melter-systems?con=t&page=16
. Process Air Control Kit Adhesive Dispensing Systems Improves adhesive add-on control and regulates pressure fluctuations to improve bond quality EF 60 V Edge Filling and Edge Sealing Slot Applicator
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/products/applicators/altaspray-c-applicator
. AltaSpray-c: produce high bond strength at low add-on rates in continuous and intermittent operations. control adhesive fiber size, density and pattern width for better bond performance
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/additional-filter-product-subtype/liquid-adhesive-applicators?con=t&page=7
fiber deposition in a cross-web direction to improve bond performance New Edge Banding Slot Applicator Increases Edge Banding Flexibility and Productivity - News Release Adhesive Dispensing Systems EB 60
