PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_assembly-reference-designator-ipc-location_topic2515.xml
?Typically I have placed assembly ref des in the center of the component outline, which seems to be industry standard. Is there a specific IPC specification that I can refer to which states something to the effect of "Assembly ref des shall be placed in
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_library-expert-2017-02-released_topic2014.xml
(because some pad tools can only handle pad offsets). This will effect some FP Designer parts if they were made with hole offsets.Through-hole parts with pin rotations that
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/info-center/news/lee-hull-area-manager-for-powder-coating-team
Hull Area Manager for Powder Coating Team Nordson Industrial Coating Systems further expands team in the U.K. and Ireland 2018-05-22 The ICS Powder Coating team has been further strengthened by the appointment of Lee Hull as Area Manager It is with pleasure that, with immediate effect, we announce the
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jet cleaner product line. It utilizes heat and vacuum to effect vaporization. In most cases, complete thermoplastic removal is accomplished within 90-120 minutes at an operating temperature range between 427°C and 482°C (800°F and 900°F
Heller Industries Inc. | https://hellerindustries.com/bit_publications/a-practical-investigation-into-the-use-of-no-lead-solders-for-smt-reflow/
× A Practical Investigation into the use of No Lead Solders for SMT Reflow Post navigation Previous Post Previous Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force. Next Post Next
Heller Industries Inc. | https://hellerindustries.com/bit_publications/reflow-techniques-for-void-reduction/
× Reflow Techniques for Void Reduction. Post navigation Previous Post Previous The Last Will And Testament of the BGA Void. Next Post Next Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force. Search for
Heller Industries Inc. | https://hellerindustries.com/bit_publications/the-last-will-and-testament-of-the-bga-void/
× The Last Will And Testament of the BGA Void. Post navigation Previous Post Previous The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/division-applications/tubing?con=t
jet cleaner product line. It utilizes heat and vacuum to effect vaporization. BKG® JCP 1724 Jet Cleaner Polymer Processing Systems The BKG®
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. Subsequent experiences by the author with users is consistent with this figure. The initial design of the board, particularly pad geometries and solder mask parameters, also have a profound effect on the quality of soldering accomplished
