| https://www.smtfactory.com/PCBA-Cleaning-Machine-PCB-Defluxing-For-Best-Coating-and-Bonding-Effect-id43566387.html
. The cleaning effect is generally not achieved through spray jet pressure, as with inline processes, but rather via the volume of cleaning medium passed over the substrates
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Abstract 15-4 FATIGUE PROPERTIES OF Sn/3.5Ag/0.7Cu SOLDER JOINTS AND EFFECTS OF Pb-CONTAMINATION J. Oliver, M. Nylén, O. Rod, C. Markou Abstract 15-3 CASE STUDY: THE EFFECT OF SEVERE BLACK PAD DEFECT ON SOLDER BONDS ON BALL GRID ARRAY COMPONENTS Jodi Roepsch
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
Europe Monday, 6th July @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time) Presenter: Bob Willis, SMTA Europe Overview The webinar provides an introduction and a better understanding of the soldering process and the effect of poor solderability on
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
(different from de-wetting). It is usually due to the presence of an interference layer (oxidation or contamination) on the surface to be soldered
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
a surface did not wet during the soldering process. Non-wetting is recognized by the fact that the bare base metal is visible (different from de-wetting). It is usually due to the presence of an interference layer (oxidation or contamination) on the
| https://www.eptac.com/faqs/ask-helena-leo/ask/shelf-life-of-soldered-components
had no adverse effect on the ability to solder components to an interconnecting substrate. Determination of solderability can be made at the time of manufacture, at receipt of the components by the user, or just before assembly and soldering
| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding
. Doping the solder with certain elements such as zinc is one way to diminish the amount of these IMC microvoids.” The following was adapted from The Discovery and Acceptance of the Kirkendall Effect
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/thermal-compounds?con=t&page=2
Silicone-Free Thermal Interface Material. Thermal Compound 52034 synthetic non-silicone thermal grease solves the problems of contamination and migration associated with silicone-based products
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/syringe-barrels-and-cartridges?nor_division_facet_a=ed75a09dc4d949ba9281738ab6600d58&con=t&page=20
Thermal Interface Material Thermal Compound 52034 Data Sheet Nordson EFD Silicone-Free Thermal Interface Material. Thermal Compound 52034 synthetic non-silicone thermal grease solves the problems of contamination and migration associated with silicone-based products
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/thermal-compounds?con=t
Silicone-Free Thermal Interface Material. Thermal Compound 52034 synthetic non-silicone thermal grease solves the problems of contamination and migration associated with silicone-based products
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