Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. Per the IPC-A-610 , a PCB with more than 5 solder balls (<=0.13mm) within 600mm² is defective, as a diameter larger than 0.13mm violates the minimum electrical clearance principle
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
shows the difference in fracture mechanisms for a lead based and a lead free BGA solder balls. Correlating the Presence of Popcorned BGA Devices Post Reflow with solder-ball diameter measurements from X-ray Inspection
Blackfox Training Institute, LLC | https://www.blackfox.com/about/instructors/
. Bill is a Master IPC Trainer in the following courses: IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies IPC-A-610 Acceptability of Electronic Assemblies IPC 7711/7721 Rework and Repair of Electronic Assemblies IPC-A-600
| https://www.eptac.com/solder-tips/
: We have been stumped by occasional opens at the corner balls of some BGA components after reflow. We have experimented with many minor adjustments, yet this occasional problem continues
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