ORION Industries | http://orionindustries.com/pdfs/Electrically_conductive_poron.pdf
* HB HB HB HB Vertical V-1 V-1 * V-1 Volume Resistivity, Ohm-cm (expression of conductivity) Rogers Corporation Internal Shielding Effectiveness, dB: At Thickness
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-pcb-finish/
. Cost In the world of printed circuit boards, you get what you pay for. Generally, the more expensive PCB finishes like electrolytic wire bondable gold, electrolytic hard gold, and electroless nickel electroless palladium immersion gold (ENEPIG
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. For example, electroless nickel immersion gold (ENIG) is a common surface finish due to its long shelf life and RoHS compliance . However, it’s more expensive than other options
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
? What Stays the Same?" View past award winners 2018: Kazuhiro Nogita, The University of Queensland " The Role of Nickel in Solder Alloys - Part 2
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU “die to lid/heat spreader” (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-and-fabrication-in-the-aerospace-industry/
assembly to avoid damaging components during assembly. The finishing material of aerospace PCBs should be able to tolerate harsh environments. The most common choices include: Electrolytic nickel and gold. Electrolytic wire bondable gold. Electroless nickel
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
al. Abstract 17-2 IMPACTS OF BULK PHOSPHOROUS CONTENT OF ELECTROLESS NICKEL LAYERS TO SOLDER JOINT INTEGRITY AND THEIR USE AS GOLD- AND ALUMINUM-WIRE BOND SURFACES Kuldip Johal and Hugh Roberts et al. Abstract 17-2 ELECTROCHEMICAL MIGRATION ON HASL
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
. These requirements include acceptable melting point, good wettability/solderability, high adhesion/mechanical strength, and excellent conductivity
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-printed-circuit-board-use-for/
. They’re made of layers of materials, including tin-lead, nickel, and gold. They have to have high conductivity to keep the system working well
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/
(Electroless Nickel Immersion Gold): Provides excellent solderability and corrosion resistance. Commonly used for high-reliability applications
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