Heller Industries Inc. | https://hellerindustries.com/searchqueries/
reflow soldering copper reflow soldering datasheet reflow soldering defects reflow soldering electrolytic capacitors reflow soldering equipment reflow soldering failure reflow soldering footprint reflow
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/2829.html
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KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/1669.html
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51269 | http://www.pcblibraries.com/Products/FPX/UserGuide/download/Footprint%20Expert%20Through-hole%20Families.pdf
PCB Libraries, Inc.
| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor
| https://www.eptac.com/faqs/ask-helena-leo/page/7
? Read More Darkened SMT Capacitor or Resistor Terminations After LeadFree Soldering Reflow QUESTION Question: Lately some of our terminations on SMT caps and resistors look dark, almost purple, like they have been overheated during the reflow process in a lead free environment
| https://www.smtfactory.com/How-to-Choose-Insertion-Machine-for-PCB-Assembly-id48428727.html
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smd-shear
. The reflow process is highly automated, and components are mounted with very high density, so it is a difficult and time-consuming process
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/0402-min-size-land-pattern_topic30&OB=DESC_page2.html
. Here is the new solder joint goal chart for chip components. These new values for miniature parts will eliminate tombstoning issues and provide the best paste volume for the assembly process
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