Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/Pan-Pacific-2020-Program.pdf?v=20060405647
*Mark McMeen, Magnalytix, LLC Milo Fabriciton of High Strength Nico Alloy and Rh Coating Using Electroplating Method Jae-Ho Lee, Hongik University 2:45PM - 3:00PM Courtyard 3:00PM - 3:30PM Lehua/Hau 3:30PM - 4:00PM Lehua/Hau 4:00PM - 4:30PM Lehua/Hau 4:30PM - 5
Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/Pan-Pacific-2020-Program.pdf?v=20061608649
*Mark McMeen, Magnalytix, LLC Milo Fabriciton of High Strength Nico Alloy and Rh Coating Using Electroplating Method Jae-Ho Lee, Hongik University 2:45PM - 3:00PM Courtyard 3:00PM - 3:30PM Lehua/Hau 3:30PM - 4:00PM Lehua/Hau 4:00PM - 4:30PM Lehua/Hau 4:30PM - 5
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/
. Once removed, a thin coating of copper is deposited on all exposed parts of a panel, creating a metallic base for the electroplating process
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-to-present-paper-on-plasma-applications-for-wafer-level-packaging-at-icept
between the WLP layers. “The first-hand data indicate that plasma can be used especially for improving platinum-copper (Pl-Cu) interface adhesion and eliminating possible micro-voids between the Cu seed layer and the electrically plated Cu layer during electroplating,” stated Dr
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. Although gold is a noble metal, the methodology for its application, be it electroplating or immersion plating, gold will still go into a molten tin/lead or tin solder solution
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. Although gold is a noble metal, the methodology for its application, be it electroplating or immersion plating, gold will still go into a molten tin/lead or tin solder solution
| http://www.thebranfordgroup.com/dnn3/Auction/TSLE0523.aspx
Höllmüller LPI Developer with flexible transport Pill Pre-Clean Mec Etch Bond for paint + inner layers Höllmüller Anti-Tarnish for inner layers Mec Laif Shadow Line - Direct Metallization Laif Resist Stripper with cyclone Schmid Tin Stripper Laif Ni/Au manual electroplating w/post-cleaning + dryer Laif Ni/Au – chem
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/heat-treatments
. The bond of this electroplating is usually not sufficient for screws. The better method, electroless nickel plating, gives an alloy of nickel with up to 15% phosphorous
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
