Lewis & Clark | http://www.lewis-clark.com/shop/page/6/
• Manufactured in July, 2005 • Nitrogen • Edge Belt Conveyor, Mesh Belt Conveyor • Auto Chain Oiler • 350 C Max Temp • Flux Management System • 480, Volt, (3) Phase • (10) Upper and (10) Lower Convection Heating Zones • (2) Cooling Zones • Condition: Complete
Lewis & Clark | http://www.lewis-clark.com/shop/page/7/
• Edge Belt Conveyor, Mesh Belt Conveyor • Auto Chain Oiler • 350 C Max Temp • Flux Management System • 480, Volt, (3) Phase • (10) Upper and (10) Lower Convection Heating Zones
Lewis & Clark | http://www.lewis-clark.com/shop/page/21/
: USA / FOB Origin Availability: Immediate for purchase / 2-4 weeks for shipping 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 … 19 20 21 22 23 … 24 25 26 27 28 Ready To Buy
Lewis & Clark | https://www.lewis-clark.com/product/helle-1809-exl-reflow-oven/
… Search Products Search Product Categories Select a category AI-PTH (2) AOI (12) Cleaners (8) Conformal Coating (6) Conveyors (29) Feeder Repair (0) Feeders (168) Flying Probe (7) Glue Dispenser (3) In-Circuit Tester (10) OEMs (0) Other (0) Pick
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: Complete and Operational. Availability: Immediate Location/shipping: FOB/USA 1 2 3 4 5 6 7 8 9 … 10 11 12 13 14 … 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Ready To Buy? Let Us Know! First Name (required) Last Name (required) Company (required) Title
Lewis & Clark | https://www.lewis-clark.com/shop/page/9/
traceability. *All work is performed in alliance to OEM suggested preventative maintenance procedures* PACKAGING FOR SHIPMENT: All feeders are professionally packaged for safe transport and tracking information is provided to you. 1 2 3 4 5 6 … 7 8 9 10
Lewis & Clark | https://www.lewis-clark.com/shop/page/12/
: 8 Zone Reflow Oven Details: 8 Top & Bottom Heating Zones Edge Rail & Mesh Belt Conveyors Automatic Chain Lubrication Windows XP Operating System 220v – 3 Phase Condition: Complete
Lewis & Clark | https://www.lewis-clark.com/shop/page/4/
: Pilot V8A NEXT Flying Probe Test System Configuration 21″ x 24″ Test Area (Vertical Board Position) (1) Scanner Board (8) Mobile Test Heads w/Probes – (4) Front and (4) Rear “Active Probe
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
No Correlation between Solder Joint Void and Thermal Cycle Integrity, J. Smetana et al [10] The Smetana investigation documented that for both a ceramic BGA component and a plastic CSP component, the void diameter or area percentage had no correlation
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
No Correlation between Solder Joint Void and Thermal Cycle Integrity, J. Smetana et al [10] The Smetana investigation documented that for both a ceramic BGA component and a plastic CSP component, the void diameter or area percentage had no correlation
