| https://ipcapexexpo.org/education/call-for-technical-paper-form
2.5-D/3-D Component Packaging BGA Packaging Connectors Design for Excellence (DFX) Design for Manufacturability (DFM) Design for Test (DFT) Die attach Embedded Passive and Active Devices Flexible Circuits Flip Chip/0201 Metric Package on Package Printed Electronics RFID Circuitry Re-balling Components Semiconductor Wire Bonding Other
Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/call_for_papers.cfm
& Posts MCM/SiP Advances Module Stacking Origami Flex Packages Package on Package (PoP) Shaped Circuits Thru Si Vias (TSV) Emerging Technologies Advanced Connectors Embedded Assembly (Passive & Active
| https://ipcapexexpo.org/education/call-for-participation
) Design for Manufacturability (DFM) Design for Test (DFT) Embedded Passive and Active Devices CAD Design Tools Printed Electronics Flexible Circuits RFID Circuitry
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
listed below: 2016: Mathias Nowottnick, Ph.D., University of Rostock " Comparison of Active and Passive Temperature Cycling " 2015: Matt Kelly, P.Eng, MBA, IBM Corporation "Via-in-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and
PCB Libraries, Inc. | http://www.pcblibraries.com/pod/
ANDANTA Andon Anglia Antenova Antique Electronic Supply Apem Apex Microtechnology API Delevan API Technologies Aquantia Arch Electronics Arduino Aries Artesyn Embedded Technologies ASJ Assmann Atlanta
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp
ANDANTA Andon Anglia Antenova Antique Electronic Supply Apem Apex Microtechnology API Delevan API Technologies Aquantia Arch Electronics Arduino Aries Artesyn Embedded Technologies ASJ Assmann Atlanta
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/
ANDANTA Andon Anglia Antenova Antique Electronic Supply Apem Apex Microtechnology API Delevan API Technologies Aquantia Arch Electronics Arduino Aries Artesyn Embedded Technologies ASJ Assmann Atlanta
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm
) testing for fault detection/fault isolation on the productions line using ICT, flying probe and vision for correcting the processes. Finally at the system level, static and dynamic functional test are performed using embedded firmware, boundary SCAN and functional test equipment