Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5495
: The influence of the electroless deposition of Pd in electroless Ni-P/electroless Pd/immersion Au (ENEPIG) plating was investigated on the reliability of Au and Cu wire-bonding
40731 | https://www.smta.org/harsh/2018-Harsh-Environments-Program.pdf
Surface Mount Technology Association (SMTA)
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-pcb-finish/
. Cost In the world of printed circuit boards, you get what you pay for. Generally, the more expensive PCB finishes like electrolytic wire bondable gold, electrolytic hard gold, and electroless nickel electroless palladium immersion gold (ENEPIG
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. Electroless nickel electroless palladium immersion gold (ENEPIG) has a high solder strength and reduces corrosion, but it requires greater care in processing to achieve the best performance
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Suthakaran, Russell Brush, Doug Perovic Abstract 31-1 Influence of Electroless Pd Plating Film Thickness on Solder Joint Relibility of ENEPIG Yoshinori Ejiri, Takehisa Sakurai, Yoshinori Arayama, Yoshiaki
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
Technical Cleanliness) Special risk on RF assemblies? Case Study: Evaluation of Bondability on ENEPIG surfaces Forecast and Perspectives About the Presenter Stefan Strixner has a Master of Science in Technical Chemistry and supports customers since foundation
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
Technical Cleanliness) Special risk on RF assemblies? Case Study: Evaluation of Bondability on ENEPIG surfaces Forecast and Perspectives About the Presenter Stefan Strixner has a Master of Science in Technical Chemistry and supports customers since foundation
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