46 enig results

IPC Specifications, Related Questions and Interpretations Question #1 Existing Condition: •  ENIG SMT pads on a flex circuit, pads use teardrop layout and the component size is 0603

| https://www.eptac.com/wp-content/uploads/2016/08/eptac_08_17_16.pdf

IPC Specifications, Related Questions and Interpretations Question #1 Existing Condition: •  ENIG SMT pads on a flex circuit, pads use teardrop layout and the component size is 0603

| https://www.eptac.com/wp-content/uploads/2021/11/eptac_08_17_16.pdf

PCB Assembly Technology Roadmap | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/

• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control

Imagineering, Inc.

PCB Fabrication Technology Roadmap | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/

• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control

Imagineering, Inc.

PCB Assembly Tolerances | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/tolerances/

. They provide enough variation for us to assemble your board – and for it to work properly in your application. Supported PC Board Specs: Min size:  1.967 in. X 1.967 in. Max size:  19.67 in. X 19.67 in. Min thickness:  4 mil Max thickness:  240 mil Layer Count:  Up to 24 Finishes:  HASL, ENIG, Silver

Imagineering, Inc.

 Time above liquidus, 60 – 90 sec and 90 to 120 seconds  Board finish, ENIG and OSP 25 Initial Results  Lower peak temp and shorter TAL did not result in acceptable solder joints 26 Results

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf

Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly

board’s acceptance in final assembly? Answer: The gold plating on boards is typically an ENIG coating, which is Electroless Nickell, Immersion Gold plating

Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/failing-to-remove-gold-plating-in-final-assembly/

board’s acceptance in final assembly? Answer: The gold plating on boards is typically an ENIG coating, which is Electroless Nickell, Immersion Gold plating

Solder Paste Archives - PCBASupplies

| https://pcbasupplies.com/solder-paste/

: high to low Halogen Free Solder Paste $ 89.23 Add to cart High Reliability Alloy Solder Paste For ENIG $ 140.00 Add to cart JM-20 Sn60/Pb40

0.47 7 Atmospheric - 7.64 8 5 15 0.48 Test #7 Details-No Vacuum Test #1 w/ 5 Torr for 30 seconds 0.21% worst case voids Results Stencil Design #2 1. QFN “MLF 100” of With Vacuum & Without Vacuum # Type 2 # without Vacuum # with Vacuum ( 5torr 60sec ) Results ENIG ( 20torr / 30sec ) ENIG ( 20torr / 60 sec

46969 | https://hellerindustries.com/wp-content/uploads/2018/07/Inline-Vacuum-Reflow-System.pdf

Heller Industries Inc.

46969