Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
The Last Will And Testament of the BGA Void THE LAST WILL AND TESTAMENT OF THE BGA VOID David Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, and Ross Wilcoxon Rockwell Collins
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
. Layer Count 50 Max. Working Panel Size 21" x 31" Max. Board Thickness .300" Min. Board Thickness 0.16"(6L) Min. Line/Space • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) Warpage .001" / sq. in. BGA Pitch 0.20mm Layer to Layer Registration 3 mil
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/
. Layer Count 50 Max. Working Panel Size 21" x 31" Max. Board Thickness .300" Min. Board Thickness 0.16"(6L) Min. Line/Space • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) Warpage .001" / sq. in. BGA Pitch 0.20mm Layer to Layer Registration 3 mil
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
ELECTRONICS ASSEMBLY Alan Rae Abstract 18-2 RELIABILITY ANALYSIS OF SOME CERAMIC LEAD-FREE SOLDER ATTACHMENTS Olli Salmela et al. Abstract 18-2 FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TEST Anurag Bansal, Sam Yoon
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. B Ball Grid Array (BGA) A surface-mount component containing a processor, and sometimes additional components, where the bottom has a grid of connection points with solder balls attached
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
(e.g. tensile strength, melting temperatures). Area Array Package A surface-mount component with a grid of connection points on the bottom. B Ball Grid Array (BGA
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
; this was consistent with work from others [6]. As a result some BGA components on notebook products required partial underfilling (or edge glue