135 enig finish problems results

PCB Assembly Technology Roadmap | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/

• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control

Imagineering, Inc.

PCB Fabrication Technology Roadmap | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/

• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control

Imagineering, Inc.

. Original circuits were HASL, new products have ENIG Question: •  Will this create any gold embrittlement with the use of ENIG? 2 Question #1 •  From IPC 6012 Table 3-2 Final Finish and Coating Requirements, the parameters for ENIG coating is as shown

| https://www.eptac.com/wp-content/uploads/2016/08/eptac_08_17_16.pdf

. Original circuits were HASL, new products have ENIG Question: •  Will this create any gold embrittlement with the use of ENIG? 2 Question #1 •  From IPC 6012 Table 3-2 Final Finish and Coating Requirements, the parameters for ENIG coating is as shown

| https://www.eptac.com/wp-content/uploads/2021/11/eptac_08_17_16.pdf

 Time above liquidus, 60 – 90 sec and 90 to 120 seconds  Board finish, ENIG and OSP 25 Initial Results  Lower peak temp and shorter TAL did not result in acceptable solder joints 26 Results

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf

Beyond the Surface: A Peek into How PCBs Are Made

Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/

. Common types of surface finishes are: HASL (Hot Air Solder Leveling): A cost-effective finish that enhances solderability and protects copper. ENIG

Imagineering, Inc.

J-STD-001E-2010: 4.5.1, Gold Removal Issues - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues

: 4.5.1, Gold Removal Issues Question: Since we are seeing more and more components with gold finish on the solder attachment pads(specifically, leadless ICs mostly with bottom side terminations only for RF circuitry

Understanding the PCB Fabrication Process: From Design to Delivery

Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/

. For example, electroless nickel immersion gold (ENIG) is a common surface finish due to its long shelf life and RoHS compliance . However, it’s more expensive than other options

Imagineering, Inc.

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print

. Lead is a heavy metal that accumulates in the body over time, resulting in various health problems that can ultimately lead to death under the worst circumstances

Boards: Get the Bare Facts on Bare Boards - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/webinars/boards-get-the-bare-facts-on-bare-boards/

covering design, fabrication and inspection. We take a look at IPC-A-600, IPC-6012 and other standards that can be crucial to support your efforts from start to finish in the fabrication process of the most critical component in your assembly