| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
? Did the wire break at the weld? Did the plating come off the board? We need to define what kind of gold plating is on the board. Is it Electroplated Gold? Is it ENIG
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
? Did the wire break at the weld? Did the plating come off the board? We need to define what kind of gold plating is on the board. Is it Electroplated Gold? Is it ENIG
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
] or more of gold thickness. b. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. c. From the surfaces to be soldered of solder terminals plated with
| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly
board’s acceptance in final assembly? Answer: The gold plating on boards is typically an ENIG coating, which is Electroless Nickell, Immersion Gold plating
| https://www.eptac.com/ask/failing-to-remove-gold-plating-in-final-assembly/
board’s acceptance in final assembly? Answer: The gold plating on boards is typically an ENIG coating, which is Electroless Nickell, Immersion Gold plating
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
. The way 001 is written, there is no exemption for surface mount components, 4.5.1b states Gold shall [N1P2D3] be removed: b. From 95% of all surface to be soldered of surface mount component regardless of gold thickness
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
] or more of gold thickness. b. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. c. From the surfaces to be soldered of solder terminals plated with
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: Soldering gold parts onto printed circuit boards follows Paragraph 4.5.1 Gold Removal in J-STD-001 as you had mentioned. The gold has to be removed from component leads whose gold thickness exceeds
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
: Soldering gold parts onto printed circuit boards follows Paragraph 4.5.1 Gold Removal in J-STD-001 as you had mentioned. The gold has to be removed from component leads whose gold thickness exceeds
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
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