| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly
board’s acceptance in final assembly? Answer: The gold plating on boards is typically an ENIG coating, which is Electroless Nickell, Immersion Gold plating
| https://www.eptac.com/ask/failing-to-remove-gold-plating-in-final-assembly/
board’s acceptance in final assembly? Answer: The gold plating on boards is typically an ENIG coating, which is Electroless Nickell, Immersion Gold plating
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
of the thickness of the plating. This same condition also applies to gold cup terminals, i.e. all the gold must be removed from within the cups regardless of gold thickness
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
begin your search Close Search • Technology Roadmap 2017 2018 2019 2020 Material • Taconic • MAGTRON • FR 4 • ISOLA • Polymide-Flex • Metal Core Min. Dieletric Thickness 2 mil Max
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/
begin your search Close Search • Technology Roadmap 2017 2018 2019 2020 Material • Taconic • MAGTRON • FR 4 • ISOLA • Polymide-Flex • Metal Core Min. Dieletric Thickness 2 mil Max
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
? Did the wire break at the weld? Did the plating come off the board? We need to define what kind of gold plating is on the board. Is it Electroplated Gold? Is it ENIG
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth
. Board thickness, finished hole size, board plating material, flux type and application method and type of solder all affect this possible defect
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
? Did the wire break at the weld? Did the plating come off the board? We need to define what kind of gold plating is on the board. Is it Electroplated Gold? Is it ENIG
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/tolerances/
. They provide enough variation for us to assemble your board – and for it to work properly in your application. Supported PC Board Specs: Min size: 1.967 in. X 1.967 in. Max size: 19.67 in. X 19.67 in. Min thickness: 4 mil Max thickness: 240 mil Layer Count: Up to 24 Finishes: HASL, ENIG, Silver
| https://www.eptac.com/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth/
) and the occurrence of voids in barrels. Board thickness, finished hole size, board plating material, flux type and application method and type of solder all affect this possible defect
