PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post9030.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic877&OB=ASC.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post3186.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
absence of a current IPC industry specification for remaining Cu plating thickness after rework, an OEM specification of 0.5 mils of remaining Cu plating was used14. Figure 6. Cu Thickness Measurement Locations EXPERIMENTAL RESULTS The statistical results
| https://www.eptac.com/faqs/soldertips/page/3
) and the occurrence of voids in barrels. Board thickness, finished hole size, board plating material, flux type and application method and type of solder all affect this possible defect
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_20_09.pdf
. Gold removal criterion was modified, it must be removed regardless of initial thickness, with the exception of ENIG boards Reflow soldering shall have a documented process with defined requirements
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. There are different plating processes used to produce different thickness including electroless and electrolytic plating. Popcorning A term used to describe the effect of water turning into steam inside electrical components during reflow
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
-center spacing of adjacent pads on a surface-mount board or leads on an electrical component. Plating A metal coating applied to a surface. There are different plating processes used to produce different thickness including electroless and electrolytic
