Partner Websites: enig sac305 (Page 1 of 1)

JM-20 Sn60/Pb40 - 0.5 mm No Clean Leaded Flux Cored Solder Wire - PCBASupplies

| https://pcbasupplies.com/jm-20-sn60-pb40-0-5-mm/

$ 93.85 Add to cart JM-20 Sn60/Pb40 – 1.0 mm No Clean Leaded Flux Cored Solder Wire $ 93.85 Add to cart More Solder Products Type-4 No-Clean Solder Paste, Halogen Free Lead-Free SAC305 Solder Paste

Surface Mount International

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

0.8 mm and peripheral HAVE HIGH Cu DISSOLUTION RATES OF SAC305/405 ALLOYS FORCED A CHANGE IN THE LEAD FREE ALLOY USED DURING PTH PROCESSES? Craig Hamilton, P.E

Surface Mount Technology Association (SMTA)

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

, Ph.D, Sitaram Arkalgud, Ph.D, and Eric Tosaya Abstract 29-1 Effect of Gold and Copper on AuSn4 Deposition and Isothermal Durability of SAC305 Solder Joints Subhasis Mukherjee, Carlos Morillo, Lay-Ling Ong, Julie Silk, and

Surface Mount Technology Association (SMTA)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

] Investigation Specifics:  84 I/O Plastic CSP, daisy chained, 0.3mm (12 mil) diameter solderballs  Sn63 solder paste  Test vehicle: Characteristics not available, Immersion Silver (IAg) and ENIG finishes  Thermal cycling: 0°C-100

Heller Industries Inc.

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

] Investigation Specifics:  84 I/O Plastic CSP, daisy chained, 0.3mm (12 mil) diameter solderballs  Sn63 solder paste  Test vehicle: Characteristics not available, Immersion Silver (IAg) and ENIG finishes  Thermal cycling: 0°C-100

Heller Industries Inc.

Webinars and Webtorials

Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm

+125oC for 5800 cycles. It was observed that ENIG surface finish improves the component reliability comparing to OSP and ImAg. It is also observed that matching solder sphere with solder paste alloys improves the reliability in several cases, but a significant improvement was not observed when compared with the SAC305 solder spheres

Surface Mount Technology Association (SMTA)

Webinars

Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/

+125oC for 5800 cycles. It was observed that ENIG surface finish improves the component reliability comparing to OSP and ImAg. It is also observed that matching solder sphere with solder paste alloys improves the reliability in several cases, but a significant improvement was not observed when compared with the SAC305 solder spheres

Surface Mount Technology Association (SMTA)

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