19 enig temperature results

IPC Specifications, Related Questions and Interpretations Question #1 Existing Condition: •  ENIG SMT pads on a flex circuit, pads use teardrop layout and the component size is 0603

| https://www.eptac.com/wp-content/uploads/2021/11/eptac_08_17_16.pdf

.  Will the flux be able to sustain the elevated temperatures of the Lead-Free Process 7 Issues  Lead free BGA’s were not recommended for Sn/Pb assembly using temperature below 220oC (428oF

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf

0.47 7 Atmospheric - 7.64 8 5 15 0.48 Test #7 Details-No Vacuum Test #1 w/ 5 Torr for 30 seconds 0.21% worst case voids Results Stencil Design #2 1. QFN “MLF 100” of With Vacuum & Without Vacuum # Type 2 # without Vacuum # with Vacuum ( 5torr 60sec ) Results ENIG ( 20torr / 30sec ) ENIG ( 20torr / 60 sec

46969 | https://hellerindustries.com/wp-content/uploads/2018/07/Inline-Vacuum-Reflow-System.pdf

Heller Industries Inc.

46969

0.47 7 Atmospheric - 7.64 8 5 15 0.48 Test #7 Details-No Vacuum Test #1 w/ 5 Torr for 30 seconds 0.21% worst case voids Results Stencil Design #2 1. QFN “MLF 100” of With Vacuum & Without Vacuum # Type 2 # without Vacuum # with Vacuum ( 5torr 60sec ) Results ENIG ( 20torr / 30sec ) ENIG ( 20torr / 60 sec

46969 | https://hellerindustries.com/wp-content/uploads/2022/04/Inline-Vacuum-Reflow-System-1.pdf

Heller Industries Inc.

46969

Solder Selection for Printed Circuit Boards and Terminals - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-selection-for-printed-circuit-boards-and-terminals

? My second question is what kind of solder would you suggest for doing repair or adding a component to a surface mount board? Answer: The type of flux to be used is determined by the surfaces being soldered, such as HASL, OSP, ENIG, Gold, Pd, etc

Solder Selection for Printed Circuit Boards and Terminals - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/solder-selection-for-printed-circuit-boards-and-terminals/

? My second question is what kind of solder would you suggest for doing repair or adding a component to a surface mount board? Answer: The type of flux to be used is determined by the surfaces being soldered, such as HASL, OSP, ENIG, Gold, Pd, etc

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms

.   Brazing A method of joining metals that involves the use of a filler metal or alloy that melts over 450° C (842° F) and below the melting temperature of substrate materials

ASYMTEK Products | Nordson Electronics Solutions

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms

.   Brazing A method of joining metals that involves the use of a filler metal or alloy that melts over 450° C (842° F) and below the melting temperature of substrate materials

ASYMTEK Products | Nordson Electronics Solutions

, Ph.D., Xiang Wei, Ph.D., Kester Inc, An ITW Company High Temperature Component Warpage as a Function of Moisture Sensitivity (MSL) Rating *Neil Hubble, Akrometrix LLC Substrates/PCB Technology Track IMC Study of Mid-Phosphorous and High-Phosphorous ENIG

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628

Surface Mount Technology Association (SMTA)

40731

, Ph.D., Xiang Wei, Ph.D., Kester Inc, An ITW Company High Temperature Component Warpage as a Function of Moisture Sensitivity (MSL) Rating *Neil Hubble, Akrometrix LLC Substrates/PCB Technology Track IMC Study of Mid-Phosphorous and High-Phosphorous ENIG

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619

Surface Mount Technology Association (SMTA)

40731