Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
solder ball attach for BGA) on TIMs voiding. Fig. 8 below shows an x-ray result after sTIM reflow, then after subsequent SAC reflow (details later). Fig. 8: Reflow#1 vs. Reflow#2 – same part In the case of Heller Industries, the task was to establish the
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
? Check the knowledge base. Webinar vs Webtorial: What's the Difference? Free Webinars (4 per year!) One session lasting 60 minutes Cost
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
., Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephani Gulbrandsen, Julie Silk, Alex Chiu, and Yew-Hoong Chan Abstract 26-4 Is a High Phosphorus Content in the Nickel Layer A Root Cause for Black Pad on ENIG Finishes? Dipl.-Ing. Mustafa Özkök, Joe
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
adding each of these above additives. In addition, both time zero analysis and ATC (0-100°C) thermal reliability analysis of the Sn-Cu + Ni solder vs. SAC405 will also be discussed. Finally, the manufacturing impact when altering the Pb-free PTH alloy will
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
. Three surface finishes including OSP, ImAg, and ENIG are considered. The test vehicle consists of 15mm and 6mm Ball Grid Array (BGA) components. The assembled test boards were isothermally aged at 125oC for 12 months, which are then thermally cycled between -40oC to
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