40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/efd/resource-center/solder-selection-guide
lötbar Kupfer Verzinkter Stahl Gold Kovar Magnesium Nicht lötbar Baustahl Monel Nichrom Nickel Nickel-Eisen/Legierung42 Nickel-Silber Palladium Platin Silber
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
) are similarly used in packages requiring additional reflow cycles. As a contrast to compliant TIMs, gold alloys (for AuSn20, k~57 W/m-K) provide solutions where the bond and alloy are strong enough to deflect the package to absorb thermal strains
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-de/divisions/efd/resources/solder-selection-guide
für das kleinste Merkmal in der Anwendung haben? Verbleit vs. bleifrei Viele Anwendungen erfordern die Verwendung einer bleifreien Lotlegierung
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
) and Gold Embrittlement Conditions David Hillman and Daphne Gates Abstract 32-3 Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
? Check the knowledge base. Webinar vs Webtorial: What's the Difference? Free Webinars (4 per year!) One session lasting 60 minutes Cost
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
. Three surface finishes including OSP, ImAg, and ENIG are considered. The test vehicle consists of 15mm and 6mm Ball Grid Array (BGA) components. The assembled test boards were isothermally aged at 125oC for 12 months, which are then thermally cycled between -40oC to
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