Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly
board’s acceptance in final assembly? Answer: The gold plating on boards is typically an ENIG coating, which is Electroless Nickell, Immersion Gold plating
Surface Mount Technology Association (SMTA) | https://www.smta.org/certification/recertification.cfm
. James Hall are divided into 11 modules each with slides and a quiz on the following updated topics: PCB Basics and Surface Finishes like HASL and ENIG Surface Finishes like OSP, Immersion Tin, Immersion Silver Paste, stencils, printing and how they are interrelated Component placement with a focus
| https://www.eptac.com/ask/failing-to-remove-gold-plating-in-final-assembly/
board’s acceptance in final assembly? Answer: The gold plating on boards is typically an ENIG coating, which is Electroless Nickell, Immersion Gold plating
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post9030.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic877&OB=ASC.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post3186.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. For example, electroless nickel immersion gold (ENIG) is a common surface finish due to its long shelf life and RoHS compliance . However, it’s more expensive than other options
