Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. Using gold and palladium also makes ENEPIG an expensive option for a finish. Standard hot air solder leveling (HASL) is cost-effective, long-lasting, and reworkable
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-and-fabrication-in-the-aerospace-industry/
with immersion gold coating (ENIG) and immersion silver. Hot air solder leveling (HASL) is a type of PCB finish that involves dipping the PCB into molten solder, which covers exposed copper surfaces. The PCB is then passed between hot air knives to
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. Immersion silver surface finish eliminated due to corrosion risk Alternative finish must meet ICT and solderability requirements Investigate several alternatives (OSP, ImSn, ENIG, and LF HASL) PCB laminate may change from what was used on DT and NB products
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
ELECTRONICS ASSEMBLY Alan Rae Abstract 18-2 RELIABILITY ANALYSIS OF SOME CERAMIC LEAD-FREE SOLDER ATTACHMENTS Olli Salmela et al. Abstract 18-2 FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TEST Anurag Bansal, Sam Yoon
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
? Check the knowledge base. Webinar vs Webtorial: What's the Difference? Free Webinars (4 per year!) One session lasting 60 minutes Cost
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. However, the high tensile strength of AuSn20, not to mention its cost, limits its use to smaller die only. The high conductivity of metal is due to the majority contribution of electronic phonons rather than lattice vibrations
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
+125oC for 5800 cycles. It was observed that ENIG surface finish improves the component reliability comparing to OSP and ImAg. It is also observed that matching solder sphere with solder paste alloys improves the reliability in several cases, but a significant improvement was not observed when compared with the SAC305 solder spheres
| 1 |
