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Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

. The test boards were fabricated with Panasonic R-1755V high temperature PCB laminate and Entek HT Plus organic solderability preservative (OSP) final finish

Heller Industries Inc.

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf

. The test boards were fabricated with Panasonic R-1755V high temperature PCB laminate and Entek HT Plus organic solderability preservative (OSP) final finish

Heller Industries Inc.