Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Dispense-System-Service-Guide-22290008G.pdf
Dispense System Service Guide Automated Dispense System Service Guide Version 5.1 May 18, 2018 Part No. 22290008G for dispense system models: DS Series
GPD Global | https://www.gpd-global.com/co_website/pdf/GPD-Global-CMRT-2021.xlsx
://www.conflictfreesourcing.org. 4.20 CFSI CMRT Team November 30, 2016 1. Corrections to all bugs and errors 2. Enhancements which do not conflict with IPC-1755 a. Additions and clarifications in the instructions and definitions b. Update to ISO short names for countries 3
GPD Global | https://www.gpd-global.com/pdf/GPD-Global-CMRT-2021.xlsx
://www.conflictfreesourcing.org. 4.20 CFSI CMRT Team November 30, 2016 1. Corrections to all bugs and errors 2. Enhancements which do not conflict with IPC-1755 a. Additions and clarifications in the instructions and definitions b. Update to ISO short names for countries 3
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