| https://fluxconnectivity.com/category/jit/
JIT Archives - Flux Connectivity Solutions FluxLab™ Contract Manufacturing Labor Optimization Integrated Solutions Products Company Mission
| https://fluxconnectivity.com/category/5s/
5S Archives - Flux Connectivity Solutions FluxLab™ Contract Manufacturing Labor Optimization Integrated Solutions Products Company Mission
| https://fluxconnectivity.com/what-is-level-loading-in-manufacturing/
What Is Level Loading In Manufacturing? - Flux Connectivity Solutions FluxLab™ Contract Manufacturing Labor Optimization Integrated Solutions Products Company Mission
| http://etasmt.com/cc?ID=te_news_bulletin,23572&url=_print
. Process and design-related causes: • Excessive volume of solder due to improper pad dimension • Excessive volume of solder due to improper stencil aperture
| http://etasmt.com/cc?ID=te_news_bulletin,23573&url=_print
. Process and design-related causes: • Solder paste flux not aggressive enough for level of oxidation present on part or PCB • PCB pad contaminated
| http://etasmt.com/cc?ID=te_news_bulletin,23568&url=_print
: solder balls Solder balls are very small fines of solder that have separated from the main body that forms the joint. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow
| http://etasmt.com/te_news_bulletin/2021-08-31/23572.chtml
. Process and design-related causes: • Excessive volume of solder due to improper pad dimension • Excessive volume of solder due to improper stencil aperture
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23572.chtml
. Process and design-related causes: • Excessive volume of solder due to improper pad dimension • Excessive volume of solder due to improper stencil aperture
| http://etasmt.com/te_news_bulletin/2021-08-31/23568.chtml
. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23568.chtml
. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
