Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf
. The typical form for such a profile, Figure 1b, is commonly referred to as a “tent” or “straight ramp” profile. For no- clean pastes, which have less active fluxes, excessive dwell time serves only to deplete the flux before reflow
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
. The typical form for such a profile, Figure 1b, is commonly referred to as a “tent” or “straight ramp” profile. For no- clean pastes, which have less active fluxes, excessive dwell time serves only to deplete the flux before reflow
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/00600-248-1.pdf
. The typical form for such a profile, Figure 1b, is commonly referred to as a “tent” or “straight ramp” profile. For no- clean pastes, which have less active fluxes, excessive dwell time serves only to deplete the flux before reflow
| https://www.eptac.com/soldertips/accept-or-reject-solder-contacting-component-bodies/
. If this condition occurred during a wave or reflow soldering process, then this points to underlying process issues. With wave soldering, if there is excessive solder flow up through the holes, this may indicate the possibility that the board is traveling too slowly in the process
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23573.chtml
. Process and design-related causes: • Solder paste flux not aggressive enough for level of oxidation present on part or PCB • PCB pad contaminated
| http://etasmt.com/cc?ID=te_news_bulletin,19161&url=_print
: check the oxygen analyzer pool to ensure that the water volume is between the maximum and minimum indicator lines to avoid excessive water volume 5
| http://etasmt.com/te_news_bulletin/2021-08-31/23573.chtml
. Process and design-related causes: • Solder paste flux not aggressive enough for level of oxidation present on part or PCB • PCB pad contaminated
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/
. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
Heller Industries Inc. | https://hellerindustries.com/solder-ball-defects/
. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects
. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
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