Partner Websites: excessive flux (Page 3 of 6)

News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?pageID=newsList&ID=te_news,0&pNum=18

. Show Details The Generation 4.1 flux management system The Generation 4.1 flux management system has been developed for machines equipped to run with an inert atmosphere and is the latest evolution of I.C.T Industries’ succe

Gold Removal Issues with Hollow Cup Connectors | EPTAC

| https://www.eptac.com/soldertips/gold-removal-issues-with-hollow-cup-connectors/

. Are there other methods we could explore? Answer: I understand your methodology is loosening the pins which is a result of the softening up the plastic housing from excessive heat

Accept or Reject: Solder Contacting Component Bodies - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/accept-or-reject-solder-contacting-component-bodies

. If this condition occurred during a wave or reflow soldering process, then this points to underlying process issues. With wave soldering, if there is excessive solder flow up through the holes, this may indicate the possibility that the board is traveling too slowly in the process

PCB Nonwetting

Heller Industries Inc. | https://hellerindustries.com/nonwetting/

. Process and design-related causes of PCB Nonwetting: Solder paste flux not aggressive enough for level of oxidation present on part or PCB PCB pad contaminated Component lead contaminated Excessive moisture absorbed by paste Paste exposed beyond

Heller Industries Inc.

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms

. Excessive preheat can reduce flux effectiveness.   Printing A process for transferring solder to a surface by forcing solder paste through a stencil or screen with a squeegee

ASYMTEK Products | Nordson Electronics Solutions

Circuit Board Voids & PCB Delamination-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2021-08-31/23574.chtml

& PCB Delamination From:    Author:    Publish time:2021-08-31 17:39    Clicks:16 Circuit Board Voids Circuit Board Voids are cavities or air pockets inside the solder joint formed by gases that are released during reflow or by flux residues that fail to escape from the solder before it solidifies

How To Remove Oxidation From Soldering Iron Tips - Blackfox

Blackfox Training Institute, LLC | https://www.blackfox.com/how-to-remove-oxidation-from-soldering-iron-tips/

Excessive heat will create oxidation build up on the tip, shortening its life You don’t need to clean the black flux residue on the tip as it does not affect soldering performance at all Conclusion Applying the proper soldering tip care can help prevent oxidation, and prolong the

Blackfox Training Institute, LLC

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms

.   Preheat The process of stabilizing the work to be soldered at a temperature below the solder melting point. Excessive preheat can reduce flux effectiveness.   Printing A process for transferring solder to a surface by forcing solder paste through a stencil

ASYMTEK Products | Nordson Electronics Solutions

How To Remove Oxidation From Soldering Iron Tips - Blackfox - Premier Training and Certification

Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/how-to-remove-oxidation-from-soldering-iron-tips/

Excessive heat will create oxidation build up on the tip, shortening its life You don’t need to clean the black flux residue on the tip as it does not affect soldering performance at all Conclusion Applying the proper soldering tip care can help prevent oxidation, and prolong the

Blackfox Training Institute, LLC

Gold Removal Issues with Hollow Cup Connectors - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/gold-removal-issues-with-hollow-cup-connectors

. Are there other methods we could explore? Answer: I understand your methodology is loosening the pins which results in softening up the plastic housing from excessive heat


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