| http://etasmt.com/cc?ID=te_news_bulletin,21161&url=_print
. Give enough time in this area to make the temperature of the larger component catch up with the smaller component, and to ensure that the flux in the solder paste is fully volatilized
| http://etasmt.com/te_news_bulletin/2020-09-12/19161.chtml
: check the oxygen analyzer pool to ensure that the water volume is between the maximum and minimum indicator lines to avoid excessive water volume 5
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
. You may have to adjust the solder paste printing pressure, or the pressure for pick and place nozzles – excessive force can squeeze the paste out of the pads, forming solder bridging defects
Heller Industries Inc. | https://hellerindustries.com/dewetting/
thin solder film and the base metal is not exposed. Process and design-related causes of PCB Dewetting: Solder paste flux not aggressive enough for level of oxidation present on part or PCB PCB pad contaminated Component lead contaminated Excessive moisture absorbed by paste Paste exposed beyond
| https://www.smtfactory.com/Introduction-to-the-working-principle-of-Lyra-Reflow-Oven-id45852477.html
. Give enough time in this area to make the temperature of the larger component catch up with the smaller component, and to ensure that the flux in the Lyra Reflow Oven solder paste is fully volatilized
Blackfox Training Institute, LLC | https://www.blackfox.com/blog/guide-to-a-successful-lead-free-soldering/
. Check the compatibility of the components, solder alloy, flux, and PWBs. One of the main challenges in implementing lead-free soldering is identifying lead-free components and they can be the most time-consuming
Blackfox Training Institute, LLC | https://www.blackfox.com/guide-to-a-successful-lead-free-soldering/
. Check the compatibility of the components, solder alloy, flux, and PWBs. One of the main challenges in implementing lead-free soldering is identifying lead-free components and they can be the most time-consuming
| https://www.smtfactory.com/Working-principle-of-I-C-T-Lyra-Series-Reflow-Oven-id48502887.html
. Give enough time in this area to make the temperature of the larger component catch up with the smaller component, and to ensure that the flux in the Lyra Reflow Oven solder paste is fully volatilized
| http://etasmt.com:9060/te_news_bulletin/2020-12-11/21161.chtml
. Give enough time in this area to make the temperature of the larger component catch up with the smaller component, and to ensure that the flux in the solder paste is fully volatilized
