Partner Websites: exhaust temperature for re-flow (Page 1 of 21)

Lead free Reflow Ovens for Printed Circuit Board Assembly and Semiconductor Packaging-Reflow oven-Re

| http://etasmt.com:9060/te_product_j/2019-07-19/3628.chtml

) Exhaust Volume 10M3/minx2 Exhausts Control System PLC+Computer Temperature Control Method PID + SSR Transmission Agent Chain + Mesh Electric Supply Required 3 phase,380V 50/60Hz Power For Warm Up 55KW 64KW Power Consumption 8KW 12KW Warming Time Approx.25 minute Temp

Lead free Reflow Ovens for Printed Circuit Board Assembly and Semiconductor Packaging-Reflow oven-Re

| http://etasmt.com/te_product_j/2019-07-19/3628.chtml

) Exhaust Volume 10M3/minx2 Exhausts Control System PLC+Computer Temperature Control Method PID + SSR Transmission Agent Chain + Mesh Electric Supply Required 3 phase,380V 50/60Hz Power For Warm Up 55KW 64KW Power Consumption 8KW 12KW Warming Time Approx.25 minute Temp

Flow Coat™ Primer System | Nordson Automotive Systems Group

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/products/automotive-assembly-priming-systems/flow-coat-primer-system

. Re-circulation feature and nitrogen blanket help prevent material degradation.  Patented dispensing technology -  Flow Coat applies the primer to the substrate prior to the atomization point of the film

ASYMTEK Products | Nordson Electronics Solutions

Lead-free Reflow Soldering System SMT Reflow Soldering Oven-Reflow Soldering Oven-Reflow oven,SMT Re

| http://etasmt.com:9060/te_product_g_c646/2019-07-25/3828.chtml

) Exhaust Volume 10M3/minx2 Exhausts Control System PLC+Computer Temperature Control Method PID + SSR Transmission Agent Chain + Mesh Electric Supply Required 3 phase,380V 50/60Hz Power For Warm Up 55KW 64KW Power Consumption 8KW 12KW Warming Time Approx.25 minute Temp

Are You Ready for Lead-free?

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-228.pdf

exhaust 500 CFM Clean flux exhaust 150 CFM maxCold air blowers Removable cooling tube modules (2) Temperature sensor (Get point controlled to indicate cooling air blower failure) Flow sensor (Get point controlled to indicate cooling air blower failure)

Heller Industries Inc.

Are You Ready for Lead-free?

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/00600-228-1.pdf

exhaust 500 CFM Clean flux exhaust 150 CFM maxCold air blowers Removable cooling tube modules (2) Temperature sensor (Get point controlled to indicate cooling air blower failure) Flow sensor (Get point controlled to indicate cooling air blower failure)

Heller Industries Inc.

MK5 Reflow Oven for High Volume Reflow Soldering

Heller Industries Inc. | https://hellerindustries.com/product/19362043-mark5-smt-reflow-oven/

system the highest production yields of any oven! Enhanced Heater Modules Enhanced flow heater modules with 40% larger impellar, blanket the PCB with heat for the lowest delta Ts on the toughest boards

Heller Industries Inc.

Reflow Ovens -Convection Reflow Ovens For High Volume

Heller Industries Inc. | https://hellerindustries.com/19362043-mark5-smt-reflow-oven/

! Enhanced Heater Modules Enhanced flow heater modules with 40% larger impellar, blanket the PCB with heat for the lowest delta Ts on the toughest boards

Heller Industries Inc.

Cost-performance options expand for EDI® Cast Film Dies

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/news/news/2018-04-02

online die separation devices. Nordson has recently introduced next-generation technologies for these system components. In Autoflex VI-RE gauge profile control system, the stroke of the lip adjusting system has been increased by 43

ASYMTEK Products | Nordson Electronics Solutions

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf

. The rate of heat flow is driven by the temperature gradient from the junction to ambient. As the junction surface temperature rises, thermal electrons are more likely to jump the band gap and introduce bit errors

Heller Industries Inc.

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