| http://etasmt.com/cc?ID=te_news_bulletin,23568&url=_print
. Process and design-related causes: • Improper pad design • Weak solder paste (for ambient con-ditions) • Expired solder paste • Misaligned print (overlapping solder mask
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
• Improper solder volume due to improper stencil design • Paste viscosity too low • Paste metal content too low • Bad or expired solder paste
| https://www.eptac.com/blog/re-establishment-of-ipc-certification-through-certification-or-recertification
. When the term of certification has expired, the CIT or CIS is not authorized to perform the functions of a certified CIT or CIS. The MIT or CIT will make a determination if attending the recertification course is appropriate
| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml
. The oxide layer on pads or the pin’s surface has not been removed effectively. The solder paste has expired, so its flux is inactive
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23568.chtml
. Process and design-related causes: • Improper pad design • Weak solder paste (for ambient con-ditions) • Expired solder paste • Misaligned print (overlapping solder mask
| http://etasmt.com/te_news_bulletin/2021-08-31/23568.chtml
. Process and design-related causes: • Improper pad design • Weak solder paste (for ambient con-ditions) • Expired solder paste • Misaligned print (overlapping solder mask
| https://www.eptac.com/re-establishment-of-ipc-certification-through-certification-or-recertification/
. When the term of certification has expired, the CIT or CIS is not authorized to perform the functions of a certified CIT or CIS. The MIT or CIT will make a determination if attending the recertification course is appropriate
| http://etasmt.com/cc?ID=te_news_bulletin,23576&url=_print
• Improper packaging of component during shipping • Improper storage of components at incoming and on the manufacturing floor resulting in excessive absorbed moisture
Blackfox Training Institute, LLC | https://www.blackfox.com/4-common-errors-in-smt-assembly/
Printed Circuit Board Repair System Integration ESD Mechanical Assembly Series Lead Free Soldering High Temp Soldering Counterfeit Components Course Overview Course Outline Course Instructor Course
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/
. Process and design-related causes of solder ball defects: Improper pad design Weak solder paste (for ambient con-ditions) Expired solder paste Misaligned print
