Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. B Ball Grid Array (BGA) A surface-mount component containing a processor, and sometimes additional components, where the bottom has a grid of connection points with solder balls attached
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
C or more above the liquidus. If a solder joint needs to retain physical integrity during a later operation, such as a second reflow process, the peak temperature of the later operation needs to be below the solidus temperature of the alloy
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. It occurs because of intermolecular forces between the liquid and surrounding solid surfaces. Cold Solder Joint A solder connection that was made with insufficient heat
Heller Industries Inc. | https://hellerindustries.com/bit_publications/the-last-will-and-testament-of-the-bga-void/
× The Last Will And Testament of the BGA Void. Post navigation Previous Post Previous The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-courtyard-padsize-old-version-2015-08_topic2974_post11857.html
: 5193 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 25 Aug 2021 at 7:55am First of all, V2021 can be set to output IPC-7351B Solder Joint Goals and Footprint Names
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2974&OB=ASC.html
: 5380 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 25 Aug 2021 at 7:55am First of all, V2021 can be set to output IPC-7351B Solder Joint Goals and Footprint Names
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=11
… Battery Nordson DAGE Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE Hot Bump Pull Nordson DAGE Nordson DAGE has developed a unique patented technique for attaching a
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/smd-solder-mask-defined-and-nsmd-pads_topic1768.html
(solder mask defined) and NSMD (non-solder-mask-defined), NSMD will be good than SMD for BGA pad to increase solder joint reliability
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/smd-solder-mask-defined-and-nsmd-pads_topic1768_post7236.html
: San Diego, CA Status: Offline Points: 5484 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 24 Sep 2015 at 9:36pm BGA pad size and solder joint relation is totally different than Chip, SOP and
