Partner Websites: explosion solder-joint bga (Page 5 of 35)

YesTech

1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_test_xray_yestech.html

* Solder joint quality * Voids * Bond wires * Electronic and Sealed Assembies 120 Volts 1500W MAX Complete with computer - software - printer - manuals - and other accessories ...ect

1st Place Machinery Inc.

Dr Evstatin Krastev from Nordson DAGE to Present Two Ground Breaking X-ray Inspection Studies

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/dr-evstatin-krastev-from-nordson-dage-to-present-two-ground-breaking-x-ray-inspection-studies

of the solder joint. In this study, the Large Board CT technique was used in conjunction with the well-established method of Bondtest Shear in an effort to correlate the bond strength as measured by the shear test to the

ASYMTEK Products | Nordson Electronics Solutions

CR Technology CRX 2000

1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_cr_technology_crx2000_xray.html

CR Technology CRX 2000   CR Technology CRX2000 Xray Equipment Description  CR Technology Model Number: CRX2000 Serial Number: 1S1878.0100 Year 2000-2001 Hamamatsu Tube Type -130kV X-Y-Z indexing table with joystick control 18" x 24" X-Y travel Full 360 degrees rotation and tilt up to 90 degrees BGA / Flip Chip Solder joint quality

1st Place Machinery Inc.

Leadfree

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf

: T,S C, A Atmosphere: Nitrogen Temperature: 240°C Visually Good Joint but… … too much solder in heel is a potential failure point SOT Lead PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 22 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 14 Material

Heller Industries Inc.

Leadfree

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf

: T,S C, A Atmosphere: Nitrogen Temperature: 240°C Visually Good Joint but… … too much solder in heel is a potential failure point SOT Lead PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 22 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 14 Material

Heller Industries Inc.

Webinars - EPTAC - Train. Work Smarter. Succeed (3)

| https://www.eptac.com/webinars/page/3

. Learn More The Fundamentals of Solder Joint Design – Part 2 – Surface Mount Technology (SMT) Length: 21 Minutes Part 2 in this series, has everything to do with Surface Mount Technology, or more importantly surface mount components

Creep Testing | Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/creep-testing?con=t&page=15

Image Capture System Datasheet Nordson DAGE Non-Destructive Techniques for Identifying Defect in BGA Joints: TDR, 2DX and Cross-section/SEM Comparison Nordson DAGE Explorer one Brochure v5c web Nordson DAGE Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions

Flexural Testing | Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/flexural-testing?con=t&page=15

System Datasheet Nordson DAGE 4600LF Data Sheet Nordson DAGE Non-Destructive Techniques for Identifying Defect in BGA Joints: TDR, 2DX and Cross-section/SEM Comparison Nordson DAGE Explorer one Brochure v5c web Nordson DAGE Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions

Compression Testing | Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/compression-testing?con=t&page=15

: TDR, 2DX and Cross-section/SEM Comparison Nordson DAGE Explorer one Brochure v5c web Nordson DAGE Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions

Peel Testing | Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/peel-testing?con=t&page=15

Identifying Defect in BGA Joints: TDR, 2DX and Cross-section/SEM Comparison Nordson DAGE Explorer one Brochure v5c web Nordson DAGE Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE First

ASYMTEK Products | Nordson Electronics Solutions


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