1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_yestech_ytx3000_xray.html
) Variable zoom magnification to 120x Full 360 degrees of rotation *BGA / Flip Chip * Solder joint quality * Voids * Bond wires * Electronic and Sealed Assemblies
| http://etasmt.com/cc?ID=te_news_bulletin,15961&url=_print
. The role of the cooling zone is to let the temperature drop to solidify the solder joint, and the cooling rate will affect the strength of the solder joint
PCB Libraries, Inc. | http://www.pcblibraries.com/products/fpx/userguide/default.asp?ch=1.7
Denmark France Germany Italy Netherlands Sweden U.K. North America Canada USA Contact Us Footprint Expert User Guide Training & Webinars PCB Footprint Expert - USER GUIDE The Footprint Expert uses IPC-7351 compliant mathematical models, and IPC-J-STD-001 compliant solder joint goals
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_3d-step-to-vrml_topic976.xml
. You can visually validate the Footprint to ensure solder joint accuracy. I could easily zoom into the center of the BGA ball pattern
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/heated-stage
. Head-in-pillow One of the most commonly looked for defects is Head-In-Pillow or HIP. Often seen in Ball Grid Array (BGA) device connections post reflow, where the BGA ball and solder paste on the PCB pad do not form a cohesive joint
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
PLATED FR-4 PRINTED CIRCUIT BOARDS Elissa Bumiller et al. Abstract 17-2 TERNARY INTERMETALLIC COMPOUND - A REAL THREAT TO BGA SOLDER JOINT RELIABILITY Shelgon Yee, Ph. D., et al. Abstract 17-1 A COMPARISON BETWEEN POWER AND THERMAL CYCLING FOR A FC PBGA
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/technical-papers
if SnAgCu and SnPb Solder Balls during High Speed Ball Shear and Cold Ball Pull Tests This paper details the investigation of brittle solder joint failure mechanisms during high-speed solder ball shear and pull testing
Heller Industries Inc. | https://hellerindustries.com/news/page/3/
… Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing August 15, 2013 12
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/technical-papers-x-ray-inspection
Modern 2D / 3D X-ray Inspection - Emphasis on BGA, QFN, 3D Packages and Counterfeit Components Heated Stage App Note Heated Stage Reflow Simulator Reflow individual components to see solder joint
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
) in Avionics Environments" 2002: Fay Hua, Raiyo Aspandiar, Tim Rothman, Cameron Anderson, Greg Clemmons, and Mimi Klier, Intel Corporation "Solder Joint Reliability of Sn-Ag-Cu BGA Components Attached with Eutectic Pb-Sn Solder Paste" 2001: Dr
