1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_beamworks_spark400.html
movement Closed loop operation utilizing IR sensors to control solder joint temperature Input Data Standard CAD files Also requires BOM file Combined CAD & BOM Converted P
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_smt_pcb_selective_beamworks_spark400.html
movement Closed loop operation utilizing IR sensors to control solder joint temperature Input Data Standard CAD files Also requires BOM file Combined CAD & BOM Converted P
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/medical-life-science-and-pharmaceutical?con=t&page=5
2020 Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls Nordson DAGE 2D X-ray Inspection with
Heller Industries Inc. | https://hellerindustries.com/white-papers-technical-articles/
. The Last Will And Testament of the BGA Void. Reflow Techniques for Void Reduction. Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force
Heller Industries Inc. | https://hellerindustries.com/publications/
. The Last Will And Testament of the BGA Void. Reflow Techniques for Void Reduction. Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force
Baja Bid | https://bajabid.com/wp-content/uploads/2023/06/XT-V-130-flyer-EN.pdf
µBGA inspection, multi-layer board inspection and PCB solder joint inspection, it is a compact, easy-to-use, and most of all, cost- effective inspection system that is an indispensable workhorse in any
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/component-placement-courtyards_topic1905.html
. Only the Toe, Heel and Side values have been updated to include 40 new incremental pin pitches. These new values are in-line with IPC-J-STD-001 for solder joint goal acceptability. i.e
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1905&OB=ASC.html
. Example is a BGA that needs lights and camera inserted somewhere on the edge of a BGA to inspect solder joints for cracks. However, it's difficult to build every little detail about PCB layout into a library part
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/torsion-testing?con=t&page=15
-Destructive Techniques for Identifying Defect in BGA Joints: TDR, 2DX and Cross-section/SEM Comparison Nordson DAGE Explorer one Brochure v5c web Nordson DAGE Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
Solder Joint Voids - All You Should Know Jennie S. Hwang, Ph.D. $200.00 2017 Advances in Stencil Technology for Achieving Successful Printing Results Chrys Shea Free! 2017
