ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Plastic ICs/PEMs Flex Circuit Smart Card Bonded Wafers Chip Scale Package Flip Chip Hybrid Ceramic Solar Cells Packaging, Seals Materials Other Plastic ICs/PEMs
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218
: SMTA International Abstract: The Pb-free solder joint attachment reliability of two Quad Flat No-Lead (QFN) packages with different body sizes and die to package ratios (DPR
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/brittle-fracture-testing?con=t&page=16
presence of micro cracks and surface defects such as scratches and chips. In these materials, the high level of stress at the tip of a crack cannot be relieved by plastic flow and so even very small defects can lead to low failure loads
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/quadra-5-x-ray-inspection-system
Flexible X-ray inspection down to 0.35um feature size. Quadra ™ 5 is the X-ray inspection system of choice for sub micron applications such as PCB and semiconductor package inspection, counterfeit component screening and finished goods quality control
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4996
. For the material behaviors, the Garofalo equation was implemented for calculating the creep strain and to detect the crack initiation
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems
. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems?page=1
. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/flexural-testing?con=t&page=16
The Nordson DAGE 4000Plus micro materials test system can perform both three and four point bend tests. External sensors can be used to sense displacement or strain
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
Solder crack path typically found at solder joint / BGA package interface BGAs with 50% of their solder joints containing voids in the 35-60
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