Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5052
. Statistical analysis was conducted to evaluate the efficacy of the thermal treatment on improving solder joint reliability. Physical failure analysis was also performed to investigate the evolution of the microstructure and determine the combined effects of the treatment and ATC on the failure mode. Key Words
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
Metallographic cross-sectional analysis showed a void- assisted failure mode in samples built with the standard surface mount assembly process. Extremely large, strategically placed voids reduce reliability by the simple geometric effect of reducing the effective
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
Metallographic cross-sectional analysis showed a void- assisted failure mode in samples built with the standard surface mount assembly process. Extremely large, strategically placed voids reduce reliability by the simple geometric effect of reducing the effective
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/workshops.cfm
. It is the role of the Failure Analysis team to establish the link between the failure mode and the failure mechanism. Once that link is understood, the path to the solution and the responsible party for it becomes clear
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
recorded. It should be noted that only two failure modes were observed during the shear testing. They are fracture at the solder joint and component failure. For most of the samples the fracture mode was at the solder joint interface. In the data analysis
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
recorded. It should be noted that only two failure modes were observed during the shear testing. They are fracture at the solder joint and component failure. For most of the samples the fracture mode was at the solder joint interface. In the data analysis
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
Voids did not appear to alter crack propagation path 163 Voids had no effect on solder joint integrity (Figure 2) Figure 2. Failure Data Weibull Plot from Banks [5
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
Voids did not appear to alter crack propagation path 163 Voids had no effect on solder joint integrity (Figure 2) Figure 2. Failure Data Weibull Plot from Banks [5
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=11
. Nordson DAGE bondtesters provide: System accuracy up to +/- 0.1% of selected load range Shear height accuracy up to +/- 0.25µm A range of optical systems for alignment, failure mode analysis and live recording
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=13
. Nordson DAGE bondtesters provide: System accuracy up to +/- 0.1% of selected load range Shear height accuracy up to +/- 0.25µm A range of optical systems for alignment, failure mode analysis and live recording
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